high-frequency circuit board is a special printed circuit board developed specifically for high-frequency signals above 1GHz and ultra high speed data transmission scenarios above 10Gbps. The core uses a special substrate with low dielectric constant (Dk) and ultra-low dielectric loss factor (Df), combined with precision impedance control technology, to ensure stable signal transmission in complex electromagnetic environments. It is an indispensable basic hardware for high-performance computing and communication systems.
Material characteristics: Low loss substrates such as polytetrafluoroethylene (PTFE), Rogers RO series, and modified epoxy resin are used, with stable Dk values and extremely low Df, greatly reducing signal transmission attenuation.
Process accuracy: Achieving precise impedance control of ± 5% to ± 10%, combined with HDI blind buried hole, back drilling and other processes, the minimum line width can reach 35 μ m, and the interlayer alignment requirement is extremely high.
Signal guarantee: Focus on solving signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) issues, and suppress high-frequency specific interference such as reflection and crosstalk.
AI computing power and data center: It supports NVLink 5.0 and PCIe 7.0 ultra high speed interconnect links, adapts to AI servers, 800G/1.6T high-speed optical modules, and GPU clusters, eliminating data transmission bottlenecks for massive parallel computing.
6G/5G communication: supports low loss transmission in millimeter wave frequency bands above 24GHz, adapts to high-density integration requirements of Massive MIMO arrays, and is used for macro base station and micro base station RF front-end modules.
Intelligent driving: compatible with 77GHz/120GHz onboard millimeter wave radar and LiDAR signal processing, capable of stable operation in a wide temperature range of -40 ℃~85 ℃, supporting ADAS system operation.
Aerospace and satellite communication: Resist cosmic rays and extreme temperature difference interference, provide stable high-frequency signal links for spaceborne phased array antennas and avionics systems, and meet strict mechanical strength requirements.
High end industrial and medical: used in industrial robot control boards, implantable medical device PCBs, and other scenarios to ensure precise signal transmission in high reliability environments.